Low-temperature film-forming low thermal expansion polyimide
Achieve low thermal expansion with low-temperature film formation!
"Low-temperature film-forming low thermal expansion polyimide" can be film-formed at lower temperatures than conventional polyimides, which reduces thermal stress and allows for use similar to that of epoxy and other materials. It achieves high production efficiency and labor-saving, making it suitable for applications such as interlayer insulating films (for semiconductor devices, multilayer printed wiring boards, and package substrates). [Features] - Thermal expansion coefficient graded from 2 to 20 ppm/K (can be matched to the thermal expansion coefficients of various substrates) - Varnish can be stored at room temperature *For more details, please download the PDF or feel free to contact us.
- Company：ウィンゴーテクノロジー
- Price：Other
